Media Alert: Intel Architects the Data-Centric 5G Future at Mobile World Congress 2019

SANTA CLARA, Calif.–(BUSINESS WIRE)–At Mobile World Congress 2019, Intel will demonstrate solutions powering
the 5G future. Come experience compelling use cases highlighting the
power of 5G across client, cloud, network and edge, enabling Intel
customers to deliver new innovative capabilities and scalable and
efficient business models. As the world moves beyond connecting billions
of humans to connecting billions of “things,” Intel’s world-class
data-centric technologies and solutions will drive 5G’s usefulness and
presence everywhere.


Join Intel in Barcelona at MWC
2019 to see the next frontier of computing and communications
converge to deliver on the promise of 5G.


Intel at Mobile World Congress 2019


When: Feb. 25-28


Where: Barcelona; Fira Gran Via, Hall 3, Intel
Booth 3E31


What: Visit the Intel booth to experience how 5G will transform
and improve our daily lives with demos spanning industrial, retail, and
media and entertainment.


See how delivering 5G’s expanded capacity in a manufacturing setting
will enable safer, more flexible and more efficient production by
applying machine-to-machine connectivity, transformed networks,
computer vision, edge computing and AI capabilities to real-world
applications.


Learn how edge computing will enable new revenue-generating, immersive
media experiences (virtual reality/augmented reality gaming) for
consumers anywhere, without being tethered to a wired network. See how
Hollywood is embracing the power of Intel processing and software and
the visual cloud to bring its latest films to life.


5G’s gigabit speeds, transformed networks and edge computing augmented
by new computer vision and AI technologies will give retailers new
capabilities to efficiently enable retail deployments in virtually any
location without the expense of a wired infrastructure.


See the latest Intel partner ecosystem offerings in network, edge,
vRAN and base station technology – enabled by Intel® Xeon® Scalable
processors, Intel® FPGAs, Intel Atom® processors, and Intel
connectivity products.


PANELS & SPEAKERSHIPS


The Edge Computing Opportunity: Intelligent and Distributed


When: Feb. 25, 3:45-5 p.m. CET


Where: Hall 4, Auditorium 5


Sandra Rivera, Intel senior vice president and general manager of the
Network Platforms Group, joins other industry leaders as they discuss
the opportunities in the intelligent and distributed edge. With the huge
market potential and opportunity presented by 5G, carriers are
undergoing a massive network infrastructure transformation to ensure
that delivery and expectations are met. Architecting greater computing
power at the edge of a network will become a key enabler for low-latency
applications. While the centralized cloud will still be a vital
component, edge computing will be deployed closer to the endpoints,
creating new value for customers. This session will provide insights
into emerging edge computing models and concepts and highlight the
immense opportunity this technology will bring. Fellow panelists include:


Jochen Heidl, VP Automotive, Senior Solutions Integration Architect,
Cisco*


Jason Hoffman, CEO, MobiledgeX*


Yousef Khalidi, Corporate VP, Product Management, MS Azure*


Patrick Chomet, EVP, Samsung*


Patrick Lopez, VP Networks Innovation, Telefónica*


Shekar Ayyar, EVP, Strategy and Corporate Development and GM, Telco
NFV Group, VMware*


Panel: AI at the Edge versus in the Cloud


When: Feb. 27, 3-4 p.m. CET


Where: Hall 4, Auditorium 5


Asha Keddy, Intel vice president in the Technology, Systems Architecture
& Client Group and general manager of Next Generation and Standards,
will join a panel session to debate the prospects and use cases for
artificial intelligence at the edge versus in the cloud, offering vital
insight for operators who are developing implementation models. Fellow
panelists include:


Anirudh Koul, Head of AI & Research, Aria*


Tom Wilson, VP Automotive, Graphcore*


Rashmi Misra, GM, AI Platforms, Business Development, Microsoft*


Adam West, Head of Marketing, Satalia*


5G Cloud XR Summit


When: Feb. 27, 4-6 p.m. CET


Where: Hall 4, Auditorium 4


Caroline Chan, Intel vice president in the Data Center Group and general
manager of the 5G Infrastructure Division in the Network Platforms
Group, is one of several experts from companies including China Mobile*,
Deutsche Telekom* and HTC* who will discuss and share case studies and
best practices across the cloud continuum. Specifically, how cloud-based
technologies will deliver superior experiences in augmented reality,
virtual reality, mixed reality and simulated reality as well as other
variations, revolutionizing the consumption of content in both the
consumer and the enterprise sectors.


Panel: Media and Entertainment Tips and Tricks for 5G and the Network
Edge


When: Feb. 28, 11:15 a.m.–12:15 p.m. CET


Where: Hall 4, Auditorium 2


Lynn Comp, Intel vice president in the Network Platforms Group and
general manager of the Visual Cloud Division, joins a panel to discuss
why future digital success for media and entertainment companies will
only be realized by ubiquitous 5G connectivity and edge computing. The
power of the network and intelligence at the edge will unlock new
services, maximize infrastructure efficiencies and deliver on the
promise of 5G. Fellow panelists include:


Olivier Avaro, CEO, Blacknut*


Jamie Hindhaugh, COO, BT Sport*


Werner Gold, Emerging Solutions Evangelist, Red Hat*


More: Visit Intel’s newsroom at newsroom.intel.com/2019-MWC and
follow on social media at @IntelNews, @Intel and www.facebook.com/intel.


About Intel


Intel (NASDAQ: INTC), a leader in the semiconductor industry, is shaping
the data-centric future with computing and communications technology
that is the foundation of the world’s innovations. The company’s
engineering expertise is helping address the world’s greatest challenges
as well as helping secure, power and connect billions of devices and the
infrastructure of the smart, connected world – from the cloud to the
network to the edge and everything in between. Find more information
about Intel at newsroom.intel.com
and intel.com.


Intel and the Intel logo are trademarks of Intel Corporation in the
United States and other countries.


*Other names and brands may be claimed as the property of others.


Contacts

Ann GoldmannIntel Global Comms. (U.S.)+1 503 702 2412ann.goldmann@intel.com
Alistair
KempIntel Global Comms. (Europe)+44 778 974 6205alistair.kemp@intel.com