Apple’s 2nm A20 chip will sport new packaging breakthrough

Apple’s next-generation A20 chip, leveraging TSMC’s second-gen 2nm process (N2), will be smaller, more power-efficient, and positioned closer to its onboard memory, boosting performance and reducing power consumption for tasks like AI processing and high-end gaming.
Marcus Mendes for 9to5Mac:
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According to analyst Jeff Pu in a new report for GF Securities, the iPhone 18 Pro, 18 Pro Max, and the long-rumored iPhone 18 Fold are expected to debut Apple’s A20 chip, built on TSMC’s second-gen 2nm process (N2).
But that’s only part of the story. The more interesting bit is how those chips will be assembled.
For the first time, Apple is set to adopt Wafer-Level Multi-Chip Module (WMCM) packaging for its iPhone processors. WMCM allows different components, like the SoC and DRAM, to be integrated directly at the wafer level, before being diced into individual chips…
For Apple, this is a big leap in chip design, similar to when it adopted 3nm ahead of most of the industry. And for the broader mobile market, it suggests that technologies once reserved for data center GPUs and AI accelerators are making their way into smartphones.

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MacDailyNews Take: Already the wannabes can’t keep up with Apple Silicon’s next major leap looming!

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