TSMC-Amkor chip packaging deal will boost Apple chip production in the US

TSMC is expanding the capabilities of its chip plant in Arizona by partnering with the US-based Amkor Technology to add advanced packaging and test capabilities. The move will result in more US-based Apple chip production in the future.Amkor headquarters in Arizona [Amkor]TSMC's Arizona plant is just getting started with its operations after four years of construction, with the production of A16 chips at the facility in September. However, while manufacturing the chips is one thing, it still needs to be packaged.Chip packaging is one of the last steps in producing a usable chip that can be used in Apple's hardware. While TSMC makes the chip itself, chip packaging refers to the protective elements around the chip, which are also used to interface with a board. Continue Reading on AppleInsider | Discuss on our Forums