iPhone 17 could be first to get new thinner & lighter motherboard tech

According to analyst Ming-Chi Kuo, Apple is looking to use Resin Coated Copper for the motherboard in its 2025 iPhone 17, if the technology can be perfected.A motherboard or mainboard (source: Ming-Chi Kuo)It's already been claimed that the whole iPhone 17 range will have always-on displays, but now there's a rumor about the internal design, too. Ming-Chi Kuo says that Apple aims to make its iPhone mainboard using resin coated copper (RCC). Read more...