MacMusic  |  PcMusic  |  440 Software  |  440 Forums  |  440TV  |  Zicos
its
Search

Intel Lakefield Brings Its 3D Chip-Stacking Tech to Life

Tuesday January 8, 2019. 01:45 AM , from Wired: Cult of Mac
Weeks after introducing Foveros, its 3D logic stacking technology, Intel has shown off a motherboard that puts it to use.
Read more at Wired: Cult of Mac
https://www.wired.com/story/intel-lakefield
News copyright owned by their original publishers | Copyright © 2004 - 2024 Zicos / 440Network
Current Date
Nov, Fri 22 - 22:03 CET