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New Thermal Material Provides 72% Better Cooling Than Conventional Paste
Wednesday November 13, 2024. 02:30 AM , from Slashdot
Beyond just being better at cooling, the researchers claim that the higher performance reduces the energy needed to run cooling pumps and fans by up to 65%. It also unlocks the ability to cram more heat-generating processors into the same space without overheating issues. As for how you can get your hands on the material: it's yet to make it out of the labs. The UT team has so far only tested it successfully at small scales but is now working on producing larger batches to put through real-world trials with data center partners. The material has been detailed in a paper published in the journal Nature Nanotechnology. Read more of this story at Slashdot.
https://hardware.slashdot.org/story/24/11/12/2228231/new-thermal-material-provides-72-better-cooling...
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