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TSMC Unveils 1.6nm Process Technology With Backside Power Delivery
Friday April 26, 2024. 05:30 AM , from Slashdot
The most important innovation of TSMC's A16 process, which was unveiled at the company's North American Technology Symposium 2024, is the introduction of the Super Power Rail (SPR), a sophisticated backside power delivery network (BSPDN). This technology is tailored specifically for AI and HPC processors that tend to have both complex signal wiring and dense power delivery networks. Backside power delivery will be implemented into many upcoming process technologies as it allows for an increase in transistor density and improved power delivery, which affects performance. Meanwhile, there are several ways to implement a BSPDN. TSMC's Super Power Rail plugs the backside power delivery network to each transistor's source and drain using a special contact that also reduces resistance to get the maximum performance and power efficiency possible. From a production perspective, this is one of the most complex BSPDN implementations and is more complex than Intel's Power Via. Volume production of A16 is slated for the second half of 2026. 'Therefore, actual A16-made products will likely debut in 2027,' notes the report. 'This timeline positions A16 to potentially compete with Intel's 14A node, which will be Intel's most advanced node at the time.' Read more of this story at Slashdot.
https://hardware.slashdot.org/story/24/04/25/2231235/tsmc-unveils-16nm-process-technology-with-backs...
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