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Intel shows off backside power and stacked transistors at IEDM

Monday December 11, 2023. 02:15 PM , from TheRegister
Chip giant claims demo tech could 'significantly' improve device density
Intel is looking to new options for its future chips including 3D stacking of transistors to enable greater density, extending backside power, and use of gallium nitride for greater power delivery.…
Read more at TheRegister
https://go.theregister.com/feed/www.theregister.com/2023/12/11/intel_shows_off_backside_power/

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