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Intel thinks glass substrates are a clear winner in multi-die packaging

Monday September 18, 2023. 11:46 PM , from TheRegister
Don't get too excited, tech won't be ready until the end of the decade
Intel's latest gambit to keep Moore's Law on life support involves ditching organic substrates — the intermediary through which data and power flows on its way in and out of a compute die — for glass ones.…
Read more at TheRegister
https://go.theregister.com/feed/www.theregister.com/2023/09/18/intel_glass_packaging/

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