China Readying $143 Billion Package For Its Chip Firms In Face of US Curbs

China is working on a more than 1 trillion yuan ($143 billion) support package for its semiconductor industry, three sources said, in a major step towards self sufficiency in chips and to counter U.S. moves aimed at slowing its technological advances. Reuters reports: Beijing plans to roll out what will be one of its biggest fiscal incentive packages over five years, mainly as subsidies and tax credits to bolster semiconductor production and research activities at home, said the sources. It signals, as analysts have expected, a more direct approach by China in shaping the future of an industry which has become a geopolitical hot button due to soaring demand for chips and which Beijing regards as a cornerstone of its technological might.

It will also likely further raise concerns in the United States and its allies about China's competition in the semiconductor industry, say analysts. Some U.S. lawmakers are already worried about China's chip production capacity build up. The plan could be implemented as soon as the first quarter of next year. The majority of the financial assistance would be used to subsidize the purchases of domestic semiconductor equipment by Chinese firms, mainly semiconductor fabrication plants, or fabs, they said. Such companies would be entitled to a 20% subsidy on the cost of purchases. In August, President Joe Biden signed the Chips and Science Act, which includes more than $52 billion for U.S. companies producing computer chips, as well as billions more in tax credits to encourage investment in semiconductor manufacturing.

Shortly thereafter, the U.S. passed a sweeping set of regulations that aim to choke off China's access to advanced chips, the tools necessary to manufacture years-old designs, and the service and support mechanisms needed to keep chip fabrication systems running smoothly.

Read more of this story at Slashdot.